Is "black pad" still an issue for ENIG?

ISSN： 0305-6120

Source： Circuit World, Vol.36, Iss.1, 2010-02, pp. : 10-13

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

PCB failure analysis related to the ENIG black pad problem

By Ramanauskas Rimantas Selskis Algirdas Juodkazyte Jurga Jasulaitiene Vitalija

Circuit World, Vol. 39, Iss. 3, 2013-08 ,pp. : 124-132

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Identification and prevention of "Black Pad" in Sn/Pb soldering

By Lee Kong Hui

Circuit World, Vol. 37, Iss. 3, 2011-08 ,pp. : 10-15

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Factors influencing the formation of "black pad" in electroless nickel-immersion gold solderable finishes-a processing perspective

By Goosey Martin

Circuit World, Vol. 28, Iss. 3, 2002-03 ,pp. : 36-39

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

NARUC: still a major player

By Anderson B.

The Electricity Journal, Vol. 9, Iss. 2, 1996-03 ,pp. : 2-2

Elsevier

Access to resources Recommend Favorite

In this issue...

By Cohen R. Khermouch G.

The Electricity Journal, Vol. 16, Iss. 10, 2003-12 ,pp. : 2-2

Elsevier

Access to resources Recommend Favorite