Through hole plating of printed circuit boards using ultrasonically dispersed copper nanoparticles

Author： Cobley A.J.   Comeskey D.J.   Paniwnyk L.   Mason T.J.  

Publisher： Emerald Group Publishing Ltd

ISSN： 0305-6120

Source： Circuit World, Vol.36, Iss.3, 2010-08, pp. : 9-13

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