Filling through holes and blind microvias with copper using reverse pulse plating and insoluble anodes

Author: Roelfs Bernd   Dambrowsky Nina   Erben Christof   Kenny Stephen  

Publisher: Emerald Group Publishing Ltd

ISSN: 0305-6120

Source: Circuit World, Vol.38, Iss.3, 2012-08, pp. : 113-123

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Abstract