3D FEM models for numerical simulation of induction sealing of packaging material

Author: Babini A   Borsari R   Fontanini A   Dughiero F   Forzan M  

Publisher: Emerald Group Publishing Ltd

ISSN: 0332-1649

Source: COMPEL: Int J for Computation and Maths. in Electrical and Electronic Eng., Vol.22, Iss.1, 2003-01, pp. : 170-180

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