Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components

Author： Verdingovas V   Jellesen M S   Ambat R  

Publisher： Maney Publishing

ISSN： 1743-2782

Source： Corrosion Engineering, Science and Technology, Vol.48, Iss.6, 2013-09, pp. : 426-435

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