Cu filling of TSV using various current forms for three-dimensional packaging application

Author: Roh Myong-Hoon   Lee Jun-Hyeong   Kim Wonjoong   Jung Jea Pil  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.25, Iss.4, 2013-09, pp. : 209-217

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