Author: Piech M. Weronski P. Wu X. Walz J.Y.
Publisher: Academic Press
ISSN: 0021-9797
Source: Journal of Colloid and Interface Science, Vol.247, Iss.2, 2002-03, pp. : 327-341
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
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