Author： Mutoh Y. Zhao J. Miyashita Y. Kanchanomai C.
Publisher： Emerald Group Publishing Ltd
ISSN： 0954-0911
Source： Soldering & Surface Mount Technology, Vol.14, Iss.3, 2002-12, pp. : 37-45
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Tin pest in lead-containing solders
Soldering & Surface Mount Technology, Vol. 22, Iss. 1, 2010-01 ,pp. :
Access to resources
Recommend
Novel rare-earth-containing lead-free solders with enhanced ductility
By Dudek M. Sidhu R. Chawla N.
JOM, Vol. 58, Iss. 6, 2006-06 ,pp. :
Getting Ready for Lead-free Solders*
By Lee N.-C.
Soldering & Surface Mount Technology, Vol. 9, Iss. 2, 1997-02 ,pp. :
By Kariya Yoshiharu Gagg Colin Plumbridge William J
Soldering & Surface Mount Technology, Vol. 13, Iss. 1, 2001-01 ,pp. :
Developments in Lead-Free Solders and Soldering Technology
By Kang Sung K.
JOM, Vol. 54, Iss. 6, 2002-06 ,pp. :