The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing

Author： Rizvi M.J.   Chan Y.C.   Bailey C.   Lu H.   Sharif A.  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.17, Iss.2, 2005-06, pp. : 40-48

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