Dissolution of copper on Sn-Ag-Cu system lead free solder

Author: Izuta Goro   Tanabe Tsuyoshi   Suganuma Katsuaki  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.19, Iss.2, 2007-04, pp. : 4-11

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Abstract