Author: Yang Ryan S.H. Braden Derek R. Zhang Guang-Ming Harvey David M.
Publisher: Emerald Group Publishing Ltd
ISSN: 0954-0911
Source: Soldering & Surface Mount Technology, Vol.24, Iss.1, 2012-02, pp. : 30-37
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
The orientation imaging microscopy of lead-free Sn-Ag solder joints
JOM, Vol. 57, Iss. 6, 2005-06 ,pp. :
By Liu Wei Tian Yanhong Yang Lei Wang Chunqing Sun Lining
Soldering & Surface Mount Technology, Vol. 24, Iss. 3, 2012-06 ,pp. :
Analysis of crack growth in solder joints
Soldering & Surface Mount Technology, Vol. 11, Iss. 3, 1999-12 ,pp. :
Brazing Sapphire/Sapphire and Sapphire/Copper Sandwich Joints Using Sn-Ag-Ti Active Solder Alloy
Solid State Phenomena, Vol. 2018, Iss. 273, 2018-06 ,pp. :