SIEM measurements of ultimate tensile strength and tensile modulus of jetted, UV-cured epoxy resin microsamples

Author: Chang Sheng   Attinger Daniel   Chiang Fu-Pen   Zhao Yong   Patel Ranjana C  

Publisher: Emerald Group Publishing Ltd

ISSN: 1355-2546

Source: Rapid Prototyping Journal, Vol.10, Iss.3, 2004-03, pp. : 193-199

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Abstract