The bulk alloy microstructure and tensile properties of Sn-1Ag-0.5Cu- x Al lead-free solder alloys ( x =0, 1, 1.5 and 2 wt.%)

Author： Shnawah Dhafer Abdul-Ameer Sabri Mohd Faizul Mohd Badruddin Irfan Anjum Che Fa Xing

Publisher： Emerald Group Publishing Ltd

ISSN： 1356-5362

Source： Microelectronics International, Vol.29, Iss.2, 2012-05, pp. : 108-116

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