A high-throughput approach for cross-sectional transmission electron microscopy sample preparation ofthinfilms

By Yao Bo   Coffey Kevin R.  

Journal of Electron Microscopy, Vol. 57, Iss. 6, 2008-12 ,pp. : 189-194

Oxford University Press

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Cross-sectional image obtained from spherical aberration-free three-dimensional image intensity distribution in transmission electron microscopy

By Taya Masaki   Kawasaki Tadahiro   Takai Yoshizo  

Journal of Electron Microscopy, Vol. 55, Iss. 1, 2006-01 ,pp. : 27-30

Oxford University Press

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High-resolution transmission electron microscopy observation of the cross-sectional structure of reconstructed silicon (5,5,12) surface

By Liu J.   Takeguchi M.   Tanaka M.   Yasuda H.   Furuya K.  

Journal of Electron Microscopy, Vol. 50, Iss. 6, 2002-02 ,pp. : 541-544

Oxford University Press

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A modified back-etch method for preparation of plan-view high-resolution transmission electron microscopy samples

By Yao Bo   Petrova Rumyana V.   Vanfleet Richard R.   Coffey Kevin R.  

Journal of Electron Microscopy, Vol. 55, Iss. 4, 2006-08 ,pp. : 209-214

Oxford University Press

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Back-etch method for plan view transmission electron microscopy sample preparation of optically opaque films

By Yao Bo   Coffey Kevin R.  

Journal of Electron Microscopy, Vol. 57, Iss. 2, 2008-04 ,pp. : 47-52

Oxford University Press

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