Theory and experimental method to determine bonding strength envelope of bi-material interface

ISSN： 1757-9864

Source： International Journal of Structural Integrity, Vol.3, Iss.4, 2012-11, pp. : 409-423

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Purpose - It is well known that stress singularity may exist at the edges of a bonded bi-material interface due to the discontinuity of material properties. This stress singularity causes difficulty in accurately determining the bi-material interface bonding strength. This paper aims to present a new design of specimen geometry to eliminate the stress singularity and present an experimental procedure to more accurately determine the bonding strength of the bi-material interface. Design/methodology/approach - The design is based on an asymptotic analysis of the stress field near the free edge of bi-material interface. The critical bonding angle, which delineates the singular and non-singular stress field near the free edge, is determined. Findings - With the new designed specimen and a special iterative calculation algorithm, the interface bonding strength envelope of an epoxy-aluminum interface was experimentally determined. Originality/value - This new design of specimen, experimental procedure and iterative algorithm may be applied to obtain more reasonable and accurate bonding strength data for a wide range of bi-material interfaces.