Residual Stress Mapping of Epoxy Molding Compound in a Ball Grid Array Microelectronic Package Using a Fluorescent Sensor

Author： Muraki Naoki Matoba Nobuhiro Hirano Takayuki Yoshikawa Masanobu Pezzotti Giuseppe

Publisher： Society for Applied Spectroscopy

ISSN： 0003-7028

Source： Applied Spectroscopy, Vol.58, Iss.2, 2004-02, pp. : 152-159

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