Optimising diffusion bonding process parameters to attain maximum strength in Al Cu dissimilar joints using Response Surface Methodology

Author: Mahendran G.   Balasubramanian V.   Babu S.  

Publisher: Inderscience Publishers

ISSN: 1750-0591

Source: International Journal of Manufacturing Research, Vol.5, Iss.2, 2010-02, pp. : 181-198

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Abstract