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Inderscience Publishers

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Yield improvement via minimisation of step height non-uniformity in chemical mechanical planarisation (CMP) with pressure and velocity as control variables

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A comprehensive review of endpoint detection in chemical mechanical planarisation for deep-submicron integrated circuits manufacturing

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Effects of Process Parameters on Material Removal Rate and Surface Roughness in Wedm of H-13 Die Tool Steel

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Optical and electrical non-uniformity around dislocations in silicon doped GaAs

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