Sintered nanosilver paste for high-temperature power semiconductor device attachment

Author： Calata Jesus N.   Lei Thomas G.   Lu Guo-Quan  

Publisher： Inderscience Publishers

ISSN： 0268-1900

Source： International Journal of Materials and Product Technology, Vol.34, Iss.1-2, 2009-01, pp. : 95-110

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Development and investigations of compact heat-transfer equipment for a nuclear power station equipped with a high-temperature gas-cooled reactor

By Golovko V.   Dmitrieva I.   Kodochigov N.   Bykh O.  

Thermal Engineering, Vol. 60, Iss. 7, 2013-07 ,pp. : 514-520

MAIK Nauka/Interperiodica

Access to resources Recommend Favorite

Problems and prospects connected with development of high-temperature filtration technology at nuclear power plants equipped with VVER-1000 reactors

By Shchelik S.   Pavlov A.  

Thermal Engineering, Vol. 60, Iss. 7, 2013-07 ,pp. : 477-481

MAIK Nauka/Interperiodica

Access to resources Recommend Favorite

Friction in high-temperature lead coolant

By Drozdov Yu.   Beznosov A.   Bokova T.   Shumilkov A.   Makhov K.   Chernysh A.  

Russian Engineering Research, Vol. 34, Iss. 2, 2014-02 ,pp. : 71-75

Springer Publishing Company

Access to resources Recommend Favorite

Thallium based high temperature superconductors for microwave device applications

By Speller S. C.  

Materials Science and Technology, Vol. 19, Iss. 3, 2003-03 ,pp. : 269-282

Maney Publishing

Access to resources Recommend Favorite

A High-Temperature Furnace for Differential Thermal Analysis

By Zherebtsov D.A.   Mikhailov G.G.  

Industrial Laboratory, Vol. 66, Iss. 9, 2000-09 ,pp. : 609-611

Springer Publishing Company

Access to resources Recommend Favorite