Finite Element simulation for three dimensional thermal analysis of Multi-Chip Module

Author: Ping Yang   Qin Xiangnan   Shen Caijun   Liao Ningbo  

Publisher: Inderscience Publishers

ISSN: 0268-1900

Source: International Journal of Materials and Product Technology, Vol.34, Iss.3, 2009-04, pp. : 241-250

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