Failure site transition in Pb-free solder joints caused by manufacturing variabilities in BGA and MLF components in low cycle fatigue analysis

Author： Ladani Leila J.

Publisher： Inderscience Publishers

ISSN： 0268-1900

Source： International Journal of Materials and Product Technology, Vol.37, Iss.3-4, 2010-02, pp. : 312-327

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