

Author: Obraztsova I. I. Simenyuk G. Yu. Eremenko N. K.
Publisher: MAIK Nauka/Interperiodica
ISSN: 1070-4272
Source: Russian Journal of Applied Chemistry, Vol.77, Iss.3, 2004-03, pp. : 380-384
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content


By Obraztsova I. Simenyuk G. Eremenko N.
Russian Journal of Applied Chemistry, Vol. 79, Iss. 5, 2006-05 ,pp. :








New electroless copper plating bath using sodium hypophosphite as reductant
By Yuan X L Gao J Yang Z F Wang Z X Wang Z L
Surface Engineering, Vol. 28, Iss. 5, 2012-06 ,pp. :