Effect of processing route on thermomechanical properties of low temperature firing ceramic for electronic packaging

Author: Jantunen H.   Uusimäki A.   Leppävuori S.   Rautioaho R.  

Publisher: Maney Publishing

ISSN: 1743-2766

Source: British Ceramic Transactions, Vol.101, Iss.1, 2002-02, pp. : 22-24

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Abstract