Numerical simulation of thermal conductivity of MMCs: effect of thermal interface resistance

Author: Duschlbauer D.   Böhm H. J.   Pettermann H. E.  

Publisher: Maney Publishing

ISSN: 1743-2847

Source: Materials Science and Technology, Vol.19, Iss.8, 2003-08, pp. : 1107-1114

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