Author: D'Souza N. Lekstrom M. Dai H. J. Shollock B. A. Dong H. B.
Publisher: Maney Publishing
ISSN: 1743-2847
Source: Materials Science and Technology, Vol.23, Iss.9, 2007-09, pp. : 1085-1092
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract