Effect of isothermal aging on room temperature impression creep of lead free Sn–9Zn and Sn–8Zn–3Bi solders

By Mahmudi R.   Geranmayeh A. R.   Noori H.   Khanbareh H.   Jahangiri N.  

Materials Science and Technology, Vol. 26, Iss. 8, 2010-08 ,pp. : 1001-1007

Maney Publishing

Access to resources Recommend Favorite

Response to thermal cycling of tool materials under steel thixoforming conditions

By Birol Y.  

Ironmaking & Steelmaking, Vol. 37, Iss. 1, 2010-01 ,pp. : 41-46

Maney Publishing

Access to resources Recommend Favorite

Microstructure and superconducting properties of Sn–In and Sn–In–Bi alloys as Pb-free superconducting solders

By Mousavi T   Aksoy C   Grovenor C R M   Speller S C  

Superconductor Science and Technology, Vol. 29, Iss. 1, 2016-01 ,pp. : 15012-15024

IOP Publishing

Access to resources Recommend Favorite

Isothermal aging–microstructure–property relationship of SmCo 2:17 magnets

By Zheng Q. J.   Xia S.   Dozier A.   Zhai T.   Willhite J.   Effgen M. P.  

Materials Science and Technology, Vol. 22, Iss. 12, 2006-12 ,pp. : 1476-1482

Maney Publishing

Access to resources Recommend Favorite

Influence of thermal cycling on fatigue strength of Cu/Sn/Cu solder joints

By Kato H.   Masaki T.   Kageyama K.  

Materials Science and Technology, Vol. 17, Iss. 10, 2001-10 ,pp. : 1306-1312

Maney Publishing

Access to resources Recommend Favorite