Impression creep behaviour of tin based lead free solders

By Devaki Rani S.   Murthy G. S.  

Materials Science and Technology, Vol. 20, Iss. 3, 2004-03 ,pp. : 403-408

Maney Publishing

Access to resources Recommend Favorite

Impression creep behaviour of tin based lead free solders

By Rani S. Devaki   Murthy G.S.  

Materials Science and Technology, Vol. 20, Iss. 7, 2004-07 ,pp. : 885-890

Maney Publishing

Access to resources Recommend Favorite

Correlation between displacement rate and shear force in shear test of Sn–Pb and lead free solder joints

By Kim J.-W.   Joo J.   Quesnel D. J.   Jung S.-B.  

Materials Science and Technology, Vol. 21, Iss. 3, 2005-03 ,pp. : 373-380

Maney Publishing

Access to resources Recommend Favorite

Microstructure and superconducting properties of Sn–In and Sn–In–Bi alloys as Pb-free superconducting solders

By Mousavi T   Aksoy C   Grovenor C R M   Speller S C  

Superconductor Science and Technology, Vol. 29, Iss. 1, 2016-01 ,pp. : 15012-15024

IOP Publishing

Access to resources Recommend Favorite

Effect of isothermal aging on room temperature impression creep of lead free Sn–9Zn and Sn–8Zn–3Bi solders

By Mahmudi R.   Geranmayeh A. R.   Noori H.   Khanbareh H.   Jahangiri N.  

Materials Science and Technology, Vol. 26, Iss. 8, 2010-08 ,pp. : 1001-1007

Maney Publishing

Access to resources Recommend Favorite