Effect of isothermal aging on room temperature impression creep of lead free Sn–9Zn and Sn–8Zn–3Bi solders

Author: Mahmudi R.   Geranmayeh A. R.   Noori H.   Khanbareh H.   Jahangiri N.  

Publisher: Maney Publishing

ISSN: 1743-2847

Source: Materials Science and Technology, Vol.26, Iss.8, 2010-08, pp. : 1001-1007

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Abstract