Effects of triethanolamine and polyethylene glycol additives on electrodeposition of Sn-Ag solder alloy

Author： Cho J-K   Kim J-H   Lim J-H   Lee K-H   Kang S-G  

Publisher： Maney Publishing

ISSN： 1743-2847

Source： Materials Science and Technology, Vol.27, Iss.5, 2011-05, pp. : 970-972

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