Experiments on the aging of Sn–Ag–Cu solder alloys

Author： Snugovsky L.   Perovic D. D.   Rutter J. W.  

Publisher： Maney Publishing

ISSN： 1743-2901

Source： Powder Metallurgy, Vol.48, Iss.2, 2005-06, pp. : 193-198

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloys

By Reid M.   Punch J.   Collins M.   Ryan C.  

Soldering & Surface Mount Technology, Vol. 20, Iss. 4, 2008-09 ,pp. : 3-8

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Reflow profile study of the Sn-Ag-Cu solder

By Salam B   Virseda C   Da H   Ekere N.N.   Durairaj R  

Soldering & Surface Mount Technology, Vol. 16, Iss. 1, 2004-02 ,pp. : 27-34

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

The effects of additives to SnAgCu alloys on microstructure and drop impact reliability of solder joints

By Liu Weiping   Lee Ning-Cheng  

JOM, Vol. 59, Iss. 7, 2007-07 ,pp. : 26-31

Springer Publishing Company

Access to resources Recommend Favorite

Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys

By Noor Ervina Efzan Mhd   Singh Amares  

Soldering & Surface Mount Technology, Vol. 26, Iss. 3, 2014-05 ,pp. : 147-161

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

The observation and simulation of Sn-Ag-Cu solder solidification in chip-scale packaging

By Kim Keun-Soo   Suganuma Katsuaki   Hwang Chi-Won   Kim Jong-Min  

JOM, Vol. 56, Iss. 6, 2004-06 ,pp. : 39-43

Springer Publishing Company

Access to resources Recommend Favorite