SiCp/Cu composites prepared by pressureless infiltration of copper into porous SiC preforms

Author: Zhang L.   Qu X. H.   He X. B.   Duan B. H.   Ren S. B.   Qin M. L.  

Publisher: Maney Publishing

ISSN: 1743-2901

Source: Powder Metallurgy, Vol.51, Iss.1, 2008-03, pp. : 53-58

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Abstract