Effect of surface condition and bonding pressure on quality of diffusion bonded high purity copper for linear collider accelerator structures

Author： Elmer J.W.   Klingman J.   van Bibber K.  

Publisher： Maney Publishing

ISSN： 1743-2936

Source： Science and Technology of Welding & Joining, Vol.6, Iss.5, 2001-10, pp. : 268-272

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