Electrodeposition of copper on aligned multi-walled carbon nanotubes

Author： Schneider M   Weiser M   Dörfler S   Althues H   Kaskel S   Michaelis A  

Publisher： Maney Publishing

ISSN： 1743-2944

Source： Surface Engineering, Vol.28, Iss.6, 2012-07, pp. : 435-441

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