A New Adhesive System for Heat Sink Bonding

Author: Hamilton S.  

Publisher: Emerald Group Publishing Ltd

ISSN: 0305-6120

Source: Circuit World, Vol.17, Iss.2, 1993-12, pp. : 16-17

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract