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Circuit World, Vol. 33, Iss. 4, 2007-11 ,pp. : 3-8

Emerald Group Publishing Ltd

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Modeling of multi-layer circuit boards by using a model of bi-phase and elasto-plastic plies

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Circuit World, Vol. 33, Iss. 3, 2007-08 ,pp. : 9-20

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SAVIA, an advanced multi-layer parallel lamination technique for high density, high performance printed circuit boards

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