The Resistance of Space-Quality Solder Joints to Thermal Fatigue: Part 2

By Dunn B.D.  

Circuit World, Vol. 6, Iss. 1, 1993-12 ,pp. : 16-27

Emerald Group Publishing Ltd

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Sensitivity study on material properties for the fatigue life prediction of solder joints under cyclic thermal loading

By Lee Shi-Wei Ricky   Zhang Xiaowu  

Circuit World, Vol. 24, Iss. 3, 1998-03 ,pp. : 26-31

Emerald Group Publishing Ltd

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Thermal cycle reliability of solder joints to alternate plating finishes

By Johnson R Wayne   Wang Vicky   Palmer Michael  

Circuit World, Vol. 25, Iss. 2, 1999-02 ,pp. : 27-30

Emerald Group Publishing Ltd

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Outgassing of Solder Joints: 'Causes and Cures?'

By Jones S.   Starkey P.  

Circuit World, Vol. 9, Iss. 4, 1993-12 ,pp. : 37-39

Emerald Group Publishing Ltd

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Quality Assessment: 16—Solder Bridging

By Bulwith Ronald A.  

Circuit World, Vol. 6, Iss. 2, 1993-12 ,pp. : 8-8

Emerald Group Publishing Ltd

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