The Resistance of Space-Quality Solder Joints to Thermal Fatigue: Part 2

Author: Dunn B.D.  

Publisher: Emerald Group Publishing Ltd

ISSN: 0305-6120

Source: Circuit World, Vol.6, Iss.1, 1993-12, pp. : 16-27

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract