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By Silva Vitor da   Oliveira Rui de   Watts David   van der Bij Erik  

Circuit World, Vol. 30, Iss. 4, 2004-04 ,pp. : 27-33

Emerald Group Publishing Ltd

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High Density Metal Core Printed Circuit Boards

By Morisaki G.   Sato T.   Kikuchi H.  

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SAVIA, an advanced multi-layer parallel lamination technique for high density, high performance printed circuit boards

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Circuit World, Vol. 31, Iss. 3, 2005-09 ,pp. : 17-20

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Can laser direct imaging (LDI) meet the needs of high density interconnect (HDI) mass-production and packaging manufacturers?

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Computerised Information Management for Printed Circuit Board Production

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