Clad Metal Circuit Board Substrates for Direct Mounting of Ceramic Chip Carriers

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Circuit World, Vol. 9, Iss. 1, 1993-12 ,pp. : 4-7

Emerald Group Publishing Ltd

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Halogen-free laminates: worldwide trends, driving forces and current status

By Boysère Jérôme De   Beard Adrian  

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Emerald Group Publishing Ltd

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Load Frequency Control of Multi-source Multi-area Hydro Thermal System Using Flexible Alternating Current Transmission System Devices

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Electric Power Components and Systems, Vol. 42, Iss. 9, 2014-07 ,pp. : 927-934

Taylor & Francis Ltd

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How advanced low coefficient of thermal expansion (CTE) laminates and prepregs can improve the reliability of printed circuit boards (PCBs)

By Weinhold Michael   Yen George  

Circuit World, Vol. 29, Iss. 1, 2003-01 ,pp. : 24-31

Emerald Group Publishing Ltd

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X-ray Inspection of Flip Chip Attach Using Digital Tomosynthesis

By Rooks S.   Sack T.  

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Emerald Group Publishing Ltd

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