Thermal designs for mobile phones cooled with use of phase change material and heat pipe

Author: Kumaresh Govindan Radhakrishnan   Duan Fei   Tan Fock-Lai   Tso Chih-Ping  

Publisher: Inderscience Publishers

ISSN: 1477-9056

Source: International Journal of Product Development, Vol.18, Iss.5, 2013-12, pp. : 411-432

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Abstract