Author: Bhaskar Ankam Jhang C.-S. Liu Chia-Jyi Hsieh Huey-Lin Huang Jing-Yi
Publisher: Springer Publishing Company
ISSN: 0957-4522
Source: Journal of Materials Science: Materials in Electronics, Vol.24, Iss.12, 2013-12, pp. : 4857-4861
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Abstract
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