Gold wire bondability of electroless gold plating using disulfiteaurate complex

Author: Watanabe H.   Abe S.   Honma H.  

Publisher: Springer Publishing Company

ISSN: 0021-891X

Source: Journal of Applied Electrochemistry, Vol.28, Iss.5, 1998-05, pp. : 525-529

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract