An evaluation of electrolytic repair of discontinuous PVD copper seed layers in damascene vias

Author: Sukamto J.H.   Webb E.   Andryushchenko T.   Reid J.  

Publisher: Springer Publishing Company

ISSN: 0021-891X

Source: Journal of Applied Electrochemistry, Vol.34, Iss.3, 2004-03, pp. : 283-290

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Abstract