Effect of Cu(II) ligands on electroless copper deposition rate in formaldehyde solutions: An EQCM study

Author： PauliukaitĖ R.   Stalnionis G.   Jusys Z.   Vaškelis A.  

Publisher： Springer Publishing Company

ISSN： 0021-891X

Source： Journal of Applied Electrochemistry, Vol.36, Iss.11, 2006-11, pp. : 1261-1269

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