Investigation of moisture ingress into adhesive bonded structures using high frequency dielectric analysis

Author: Li Z-C.   Hayward D.   Gilmore R.   Pethrick R.A.  

Publisher: Springer Publishing Company

ISSN: 0022-2461

Source: Journal of Materials Science, Vol.32, Iss.4, 1997-04, pp. : 879-886

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Abstract