Silicon-to-indium tin oxide coated glass bonding for packaging of field emission arrays fabricated on silicon wafer

Author： Choi W.B.   Ju B.K.   Lee Y.H.   Oh M.H.   Lee N.Y.   Sung M.Y.  

Publisher： Springer Publishing Company

ISSN： 0022-2461

Source： Journal of Materials Science, Vol.34, Iss.19, 1999-10, pp. : 4711-4717

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