Microstructural evolution during transient liquid-phase bonding in a Ni-base superalloy/sapphire fiber composite

Author： Tseng M.W.   Williams D.B.   Soni K.K.   Levi-Setti R.  

Publisher： Springer Publishing Company

ISSN： 0022-2461

Source： Journal of Materials Science, Vol.34, Iss.21, 1999-11, pp. : 5187-5197

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