Effect of stacking fault energy and strain rate on the microstructural evolution during room temperature tensile testing in Cu and Cu-Al dilute alloys

Author： Caballero V.   Varma S.K.  

Publisher： Springer Publishing Company

ISSN： 0022-2461

Source： Journal of Materials Science, Vol.34, Iss.3, 1999-02, pp. : 461-468

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