On the interface development and fracture behaviour of roll bonded copper/aluminium metal laminates

Author: Peng X.K.   Wuhrer R.   Heness G.   Yeung W.Y.  

Publisher: Springer Publishing Company

ISSN: 0022-2461

Source: Journal of Materials Science, Vol.34, Iss.9, 1999-05, pp. : 2029-2038

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Abstract