Author: Lee K.S. Park J.Y. Kim W-J. Lee M.Y. Jung C.H. Hong G.W.
Publisher: Springer Publishing Company
ISSN: 0022-2461
Source: Journal of Materials Science, Vol.35, Iss.11, 2000-06, pp. : 2769-2777
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract